01.
Product
DESCRIPTION
Specifciation of Electronic component lead frame:
★ The raw material for lead frame is Phosphor copper.The product needs to be stamped. The thickness is 0.20mm.
★ In order to meet the mechanical properties and cost savings, the lead frame needs to be partially gold plated after stamping.
★ The lead frame has a number of similar wire ends, and the process of wire end production is extremely tedious, the conductive effect is good, and it can maintain stable physical and mechanical properties under high temperature environment, and is not easy to deformation and melting.
★ No pollution to environment. Part complies with RoHS.
★ The stamping speed is around 300-500 times/ min.
Parameter of Electronic component lead frame | |||
Place of Origin | Guangdong, China (Mainland) | Application | electronics |
Material | C5191 | Surfacetreatment | NA |
Size | 45*38*25mm | Usage | connecting |
Color | Material color | Special | OEM/ODM is welcome |
Certificate | IATF16949 ISO14001 SGS RoHS | Other | N/A |
Packaging & Delivery | |||
Single package size | 55*48*35 cm | Package Type | Plastic tray and exported carton |
Single gross weight | 9 kg | Lead Time | 15 days |
Copyright © 2023 Dongguan Fortuna Metals Co, Ltd. | All Rights Reserved.